Kinsus anticipates FC-CSP substrates to enhance blended ASP (Digi Times)
Kinsus anticipates FC-CSP substrates to enhance blended ASP (Digi Times)
Kinsus Interconnect Technology anticipates that its average selling prices (ASPs) will be enhanced amid the production of flip chip chip-scale package (FC-CSP) substrates beginning from the second quarter of 2007, according to company general manager Ming-Tung Kuo during an investors conference on May 30.